Title :
Proceedings of the IEEE: Special Issue on Materials and Material Problems in Integrated Electronics
Author :
Ghandhi, S. ; Reich, B.
Author_Institution :
Rensselaer Polytechnic Inst.
fDate :
9/1/1968 12:00:00 AM
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
DOI :
10.1109/TPMP.1968.1135894
