DocumentCode

961836

Title

Temperature profile within a metal plate having microelectronic components as heat sources and heat sinks at two extremities

Author

O´Donnell, Garret ; Honn, J.

Author_Institution

IBM Corporation,Githersburg, Md.

Volume

4

Issue

4

fYear

1968

fDate

12/1/1968 12:00:00 AM

Firstpage

110

Lastpage

114

Keywords

Bonding; Electronic components; Extremities; Heat sinks; Microelectronics; Packaging; Printed circuits; Resistance heating; Temperature measurement; Thermal spraying;

fLanguage

English

Journal_Title

Parts, Materials and Packaging, IEEE Transactions on

Publisher

ieee

ISSN

0018-9502

Type

jour

DOI

10.1109/TPMP.1968.1135898

Filename

1135898