Title :
Advanced Method for Monitoring Copper Interconnect Process
Author :
Ishikawa, Kensuke ; Nemoto, Kazunori ; Funakoshi, Tomohiro ; Ohta, Hideo
Author_Institution :
Micro Device Div., Hitachi Ltd., Ome
Abstract :
Stabilizing the copper interconnect process is the key to improving yield and reliability. A stable process for forming adequate grains in a copper film is important, but there is no proper method for monitoring the grains in that film. We introduce the micro-haze method, an advanced method for monitoring grain size using scattering light. We experimentally verified the effectiveness of the method and concluded that the method enables the monitoring the grains in a copper film.
Keywords :
copper; grain size; integrated circuit interconnections; integrated circuit reliability; light scattering; metallic thin films; size measurement; Cu; copper film; copper interconnect process monitoring; grain monitoring; light scattering; Atomic force microscopy; Copper; Grain boundaries; Grain size; Light scattering; Monitoring; Rough surfaces; Size control; Surface roughness; Transmission electron microscopy; Design of experiment; grain size of copper; micro-haze method; surface roughness;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2008.2005354
