• DocumentCode
    962672
  • Title

    Metallurgical Reactions of AgAuPd Electrodes with High Pb Solder

  • Author

    Marcotte, Vincent C. ; Koopman, Nicholas G.

  • Author_Institution
    IBM Corp, Hopewell Junction, NY, USA
  • Volume
    5
  • Issue
    4
  • fYear
    1982
  • fDate
    12/1/1982 12:00:00 AM
  • Firstpage
    395
  • Lastpage
    399
  • Abstract
    lt has been shown previously that free Ag (Pd depletion) can occur on reaction of 80Ag20Pd electrodes with high Pb, Sn-Pb solders [1]. A new ternary paste of 60Ag20Au20Pd is described which does not form free Ag on reactions with solder [2].
  • Keywords
    Soldering; Thick-film circuit reliability; Corrosion; Diffusion bonding; Electrodes; Electrons; Gold alloys; Helium; Isothermal processes; Solid state circuits; Stability; Tin;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1982.1135982
  • Filename
    1135982
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=962672