Title :
Metallurgical Reactions of AgAuPd Electrodes with High Pb Solder
Author :
Marcotte, Vincent C. ; Koopman, Nicholas G.
Author_Institution :
IBM Corp, Hopewell Junction, NY, USA
fDate :
12/1/1982 12:00:00 AM
Abstract :
lt has been shown previously that free Ag (Pd depletion) can occur on reaction of 80Ag20Pd electrodes with high Pb, Sn-Pb solders [1]. A new ternary paste of 60Ag20Au20Pd is described which does not form free Ag on reactions with solder [2].
Keywords :
Soldering; Thick-film circuit reliability; Corrosion; Diffusion bonding; Electrodes; Electrons; Gold alloys; Helium; Isothermal processes; Solid state circuits; Stability; Tin;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135982
