Title :
Prediction of Component Temperatures on Circuit Cards Cooled by Natural Convection
Author :
Campo, William A. ; Kerjilian, G. ; Shaukatullah, H.
Author_Institution :
IBM Corp, Endicott, NY, USA
fDate :
12/1/1982 12:00:00 AM
Abstract :
An empirical procedure to predict component temperatures on circuit cards cooled by natural convection is described. With this procedure, test results from cards populated with only one type of component can be used to predict temperatures on cards with a mix of components.
Keywords :
Circuit boards; Integrated circuit thermal factors; Prediction methods; Thermal factors; Circuit testing; Connectors; Diodes; Electronic packaging thermal management; Electronics packaging; Heat transfer; Printed circuits; Resistors; Temperature dependence; Temperature distribution;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135987
