DocumentCode
962719
Title
Prediction of Component Temperatures on Circuit Cards Cooled by Natural Convection
Author
Campo, William A. ; Kerjilian, G. ; Shaukatullah, H.
Author_Institution
IBM Corp, Endicott, NY, USA
Volume
5
Issue
4
fYear
1982
fDate
12/1/1982 12:00:00 AM
Firstpage
499
Lastpage
501
Abstract
An empirical procedure to predict component temperatures on circuit cards cooled by natural convection is described. With this procedure, test results from cards populated with only one type of component can be used to predict temperatures on cards with a mix of components.
Keywords
Circuit boards; Integrated circuit thermal factors; Prediction methods; Thermal factors; Circuit testing; Connectors; Diodes; Electronic packaging thermal management; Electronics packaging; Heat transfer; Printed circuits; Resistors; Temperature dependence; Temperature distribution;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1982.1135987
Filename
1135987
Link To Document