Title :
Caution-Electrostatic Discharge at Work!
Author :
Moss, Richard Y.
Author_Institution :
Hewlett Packard Company, Palo Alto, CA, USA
fDate :
12/1/1982 12:00:00 AM
Abstract :
Static charge generation by three mechanisms is explained, including two which do not involve physical contact. The sensitivity of various component technologies to electrostatic discharge (ESD) is tabulated and myths about the effects of environment and level of assembly refuted. A three-part program of ESD prevention and protection for component manufacturers and users is proposed.
Keywords :
Electrostatic processes; Integrated circuit reliability; Packaging; Semiconductor device reliability; Assembly; Circuit testing; Conducting materials; Conductors; Dielectrics and electrical insulation; Electrons; Electrostatic discharge; Protection; Surface cleaning; Surface discharges;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135989
