• DocumentCode
    962820
  • Title

    Wirebonding Reliability Techniques and Analysis

  • Author

    Ebel, G.H. ; Jeffery, J.A. ; Farrell, John P.

  • Author_Institution
    Singer Company, Wayne, NJ, USA
  • Volume
    5
  • Issue
    4
  • fYear
    1982
  • fDate
    12/1/1982 12:00:00 AM
  • Firstpage
    441
  • Lastpage
    445
  • Abstract
    A method for wirebond evaluation is presented which allows for rapid conclusions concerning the quality of wirebonds produced by a given process. It uses the whole spectrum of wirebond strengths produced by that process to arrive at a decision rather than using only information from the few weakest bonds. A quantitative failure rate can easily be assigned to the wirebonds from a given process based on statistical data. The situation where more than one failure mechanism is present in a process is discussed. Case histories are presented using the proposed method for wirebond process evaluation. Information concerning process activation energies as well as some recommendations for improving wirebonding quality are also presented.
  • Keywords
    Hybrid integrated-circuit bonding; Hybrid integrated-circuit reliability testing; Aluminum; Computer aided manufacturing; Contamination; Failure analysis; Gold; History; Intermetallic; Probability; Testing; Wire;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1982.1135997
  • Filename
    1135997