Title :
Structural Design Analysis Applied to Flexible Circuits
Author :
Skaggs, Clyde W. ; Sperling, Roger A.
Author_Institution :
General Electric Co.,Utica, NY
fDate :
12/1/1976 12:00:00 AM
Abstract :
A significant consideration to be made with respect to the application of a flexible circuit is the degree to which it can be bent when incorporated into the next level of assembly. The application of stress analysis techniques to arrive at a flexible circuit design that will be structurally sound for a given set of parameters and materials relative to the required application is discussed.
Keywords :
Mechanical factors; Printed circuits; Assembly; Conducting materials; Design engineering; Flexible electronics; Flexible printed circuits; Guidelines; Hardware; Helium; Laminates; Magnetic analysis;
Journal_Title :
Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TMFT.1976.1136032