DocumentCode :
963215
Title :
Structural Design Analysis Applied to Flexible Circuits
Author :
Skaggs, Clyde W. ; Sperling, Roger A.
Author_Institution :
General Electric Co.,Utica, NY
Volume :
5
Issue :
4
fYear :
1976
fDate :
12/1/1976 12:00:00 AM
Firstpage :
78
Lastpage :
83
Abstract :
A significant consideration to be made with respect to the application of a flexible circuit is the degree to which it can be bent when incorporated into the next level of assembly. The application of stress analysis techniques to arrive at a flexible circuit design that will be structurally sound for a given set of parameters and materials relative to the required application is discussed.
Keywords :
Mechanical factors; Printed circuits; Assembly; Conducting materials; Design engineering; Flexible electronics; Flexible printed circuits; Guidelines; Hardware; Helium; Laminates; Magnetic analysis;
fLanguage :
English
Journal_Title :
Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0046-838X
Type :
jour
DOI :
10.1109/TMFT.1976.1136032
Filename :
1136032
Link To Document :
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