• DocumentCode
    963215
  • Title

    Structural Design Analysis Applied to Flexible Circuits

  • Author

    Skaggs, Clyde W. ; Sperling, Roger A.

  • Author_Institution
    General Electric Co.,Utica, NY
  • Volume
    5
  • Issue
    4
  • fYear
    1976
  • fDate
    12/1/1976 12:00:00 AM
  • Firstpage
    78
  • Lastpage
    83
  • Abstract
    A significant consideration to be made with respect to the application of a flexible circuit is the degree to which it can be bent when incorporated into the next level of assembly. The application of stress analysis techniques to arrive at a flexible circuit design that will be structurally sound for a given set of parameters and materials relative to the required application is discussed.
  • Keywords
    Mechanical factors; Printed circuits; Assembly; Conducting materials; Design engineering; Flexible electronics; Flexible printed circuits; Guidelines; Hardware; Helium; Laminates; Magnetic analysis;
  • fLanguage
    English
  • Journal_Title
    Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0046-838X
  • Type

    jour

  • DOI
    10.1109/TMFT.1976.1136032
  • Filename
    1136032
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=963215