DocumentCode :
963373
Title :
Micro-Modules: Component Parts and Materials Requirements
Author :
Danko, S.F. ; Kublin, V.J.
Author_Institution :
U.S. Army Signal Res. and Dev. Lab.
Volume :
5
Issue :
1
fYear :
1959
fDate :
8/1/1959 12:00:00 AM
Firstpage :
29
Lastpage :
38
Abstract :
The growth of our microminiaturization capabilities to date is cited as having been random and uncoordinated. The Signal Corps\´ micro-module effort is described as a definite step toward a concept that has depth and scope. A new dimension--a ten-to-one size reduction over the best now realized, is selected as reasonably attainable in 3 to 5 years. Named as providing the background for the present program, are such designs as the Army\´s Korean "Handy-Talkie," the Navy\´s "Tinkertoy," the Bell Telephone Laboratories\´ transistor, and the Army\´s "solder-dipped printed wiring." Also credited as being a major contributor, is the recent trend toward "packaging by function" where standard modular dimensions and a throw-away maintenance philosophy buy us another two-to-one size reduction, to reach a plateau of around 50,000 parts per cubic foot. It is stressed that a positive approach is now needed toward a completely new plateau in size and packaging density, of at least 500,000 parts per cubic foot. Our present capabilities are assessed, and a ten-to-one size reduction is shown for Sprague\´s ceramic printed circuit, and two transistor amplifiers by Centralab. The Army\´s micro-module wafer element (0.3 inch X 0.3 inch X 0.01 inch thick) is announced. A model demonstrating feasibility is shown, where a complete 5-transistor superheterodyne radio receiver is built into an ordinary fountain pen. Present capabilities are displayed for fabricating component parts on the 0.09-squareinch micro element. Specific accomplishments are shown, such as: a precision metal-film resistor, a precision glass capacitor, a flatplate ceramic capacitor, a hermetically-sealed solid-tantalum electrolyte capacitor, and several other special component parts. Five categories of Army equipments (portable, vehicular, missile, projectile, and satellite), and three plateaus of temperature (+85°C, +125°C, and +200°C, above a cold level of --55°C) are selected as meeting present Army environmental requirements. The guiding philosophy, in setting up the program, is described as providing: first, a meaningful step forward based on immediately attainable tangible techniques; and second, a parallel solid-state research effort to impr- ove and mature the concept. To accomplish the "big step forward" in size reduction and "throw-away" maintenance, RCA is announced as leader-contractor to coordinate industry wide activities.
Keywords :
Capacitors; Ceramics; Foot; Laboratories; Packaging; Printed circuits; Receivers; Semiconductor device modeling; Telephony; Wiring;
fLanguage :
English
Journal_Title :
Production Techniques, IRE Transactions on
Publisher :
ieee
ISSN :
0096-1779
Type :
jour
DOI :
10.1109/TPGPT.1959.1136047
Filename :
1136047
Link To Document :
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