New Techniques in Potting, Encapsulating, and Small Parts Molding

IN this age of missiles, computers, and airborne instruments, the stringent demands placed on electronic engineers and component manufacturers to produce smaller and smaller components have necessitated new techniques in production. Equipment manufacturers, such as our company, have recently concluded extensive development programs to offer to the electronics industry the practical means for manufacturing some of these electronic component parts. This paper will discuss first, the operation and application of a packaged high vacuum degassing and potting system for short pot life resins; second, techniques for high volume encapsulating; and third, a new approach to economical molding of small thermosetting plastic parts.