• DocumentCode
    963636
  • Title

    Mechanism of Tarnishing of Precious-Metal Contact Alloys

  • Author

    Abbott, W.H.

  • Author_Institution
    Battelle Memorial Institute, Columbus, OH
  • Volume
    5
  • Issue
    4
  • fYear
    1969
  • fDate
    12/1/1969 12:00:00 AM
  • Firstpage
    156
  • Lastpage
    160
  • Abstract
    Studies of the tarnishing of the Au-Ag, Au-Cu, Pd--Ag, and Pd-Cu systems revealed that film formation was controlled by diffusion either in the surface film or in the near-surface region of the alloy. Tarnishing of the silver-containing alloys is controlled by alloy diffusion, which can be described as a two-stage process. Initially, all alloys tarnish at nearly a linear rate characteristic of the pure reactive element. Beyond a transition thickness, the alloys tarnish according to a cubic-rate law. The rate-controUing mechanism associated with the simple cubic rate was identified as "short-circuit" diffusion via dislocations and/or\´"grain boundaries. The two tarnish Charactefistics of an alloy such as Au-Ag were shown to be greatly affected by the surface metallurgical condition.
  • Keywords
    Atmosphere; Contact resistance; Copper alloys; Kinetic theory; Life estimation; Seminars; Silver; Surface finishing; Surface resistance; Testing;
  • fLanguage
    English
  • Journal_Title
    Parts, Materials and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9502
  • Type

    jour

  • DOI
    10.1109/TPMP.1969.1136073
  • Filename
    1136073