DocumentCode
963636
Title
Mechanism of Tarnishing of Precious-Metal Contact Alloys
Author
Abbott, W.H.
Author_Institution
Battelle Memorial Institute, Columbus, OH
Volume
5
Issue
4
fYear
1969
fDate
12/1/1969 12:00:00 AM
Firstpage
156
Lastpage
160
Abstract
Studies of the tarnishing of the Au-Ag, Au-Cu, Pd--Ag, and Pd-Cu systems revealed that film formation was controlled by diffusion either in the surface film or in the near-surface region of the alloy. Tarnishing of the silver-containing alloys is controlled by alloy diffusion, which can be described as a two-stage process. Initially, all alloys tarnish at nearly a linear rate characteristic of the pure reactive element. Beyond a transition thickness, the alloys tarnish according to a cubic-rate law. The rate-controUing mechanism associated with the simple cubic rate was identified as "short-circuit" diffusion via dislocations and/or\´"grain boundaries. The two tarnish Charactefistics of an alloy such as Au-Ag were shown to be greatly affected by the surface metallurgical condition.
Keywords
Atmosphere; Contact resistance; Copper alloys; Kinetic theory; Life estimation; Seminars; Silver; Surface finishing; Surface resistance; Testing;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1969.1136073
Filename
1136073
Link To Document