Title :
Sub-Modular Packaging of Airborne Electronic Systems
Author_Institution :
Tele-Dynamic Division, America Bosch Arma Cor.
fDate :
6/1/1961 12:00:00 AM
Keywords :
Aluminum; Assembly; Circuit testing; Connectors; Electronics packaging; Etching; Fasteners; Integrated circuit interconnections; Prototypes; Wiring;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1961.1136115
