High Density Electronic Packaging via Welded Honeycomb Structures

A system of packaging based on the Sperry "Honeycomb" concept is described which attempts to resolve the major problems associated with other current packaging schemes. The paper reviewsthe considerations of high density welded three-dimensional packaging and some advantages and disadvantages of the popular concepts. This method is particularly applicable to develop programs since it permits evaluationo the circuit prior to final encapsulation. The paper details a typical circuit package from its original circuit schematic through packaging layout, assembly, testing and final encapsulation. It also shows how the packaging method can be adapted to permit replacement of components if required.