Title :
Epoxy Resin Molds for Encapsulating Electronic Circuitry into Modules
Author :
Tallent, John J.
Author_Institution :
General Electric Co., Light Military Electronics Department
fDate :
6/1/1961 12:00:00 AM
Keywords :
Circuits; Design engineering; Encapsulation; Epoxy resins; Heat transfer; Maintenance engineering; Manufacturing; Reliability engineering; Resistance heating; Shape;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1961.1136125
