• DocumentCode
    964511
  • Title

    Physical Analysis of Data on Fused-Open Bond Wires

  • Author

    Loh, Eugene

  • Author_Institution
    Hughes Aircraft Company, El Segundo, CA, USA
  • Volume
    6
  • Issue
    2
  • fYear
    1983
  • fDate
    6/1/1983 12:00:00 AM
  • Firstpage
    209
  • Lastpage
    217
  • Abstract
    Peddy´s experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.
  • Keywords
    Aluminum materials/devices; Gold materials/devices; Integrated circuit bonding; Semiconductor device bonding; Aluminum; Bonding; Current density; Data analysis; Fuses; Gold; Heat transfer; Probes; Thermal conductivity; Wire;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1983.1136162
  • Filename
    1136162