DocumentCode :
964511
Title :
Physical Analysis of Data on Fused-Open Bond Wires
Author :
Loh, Eugene
Author_Institution :
Hughes Aircraft Company, El Segundo, CA, USA
Volume :
6
Issue :
2
fYear :
1983
fDate :
6/1/1983 12:00:00 AM
Firstpage :
209
Lastpage :
217
Abstract :
Peddy´s experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.
Keywords :
Aluminum materials/devices; Gold materials/devices; Integrated circuit bonding; Semiconductor device bonding; Aluminum; Bonding; Current density; Data analysis; Fuses; Gold; Heat transfer; Probes; Thermal conductivity; Wire;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1983.1136162
Filename :
1136162
Link To Document :
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