DocumentCode
964511
Title
Physical Analysis of Data on Fused-Open Bond Wires
Author
Loh, Eugene
Author_Institution
Hughes Aircraft Company, El Segundo, CA, USA
Volume
6
Issue
2
fYear
1983
fDate
6/1/1983 12:00:00 AM
Firstpage
209
Lastpage
217
Abstract
Peddy´s experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.
Keywords
Aluminum materials/devices; Gold materials/devices; Integrated circuit bonding; Semiconductor device bonding; Aluminum; Bonding; Current density; Data analysis; Fuses; Gold; Heat transfer; Probes; Thermal conductivity; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1983.1136162
Filename
1136162
Link To Document