• DocumentCode
    964535
  • Title

    Thermally Optimum Arrays of Cards and Fins in Natural Convection

  • Author

    Bar-Cohen, Avram ; Rohsenow, Warren M.

  • Author_Institution
    Ben-Gurion University, Beer-Sheva, Israel
  • Volume
    6
  • Issue
    2
  • fYear
    1983
  • fDate
    6/1/1983 12:00:00 AM
  • Firstpage
    154
  • Lastpage
    158
  • Abstract
    Recently derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces are applied to the thermal optimization of printed circuit cards and fin arrays. The procedure used and the governing relations, for both thermally symmetric and asymmetric card arrays, are presented. A similar development for arrays of natural convection fins, addressing the influence of fin thickness on the optimum fin spacing and maximum array heat dissipation, is also shown.
  • Keywords
    Printed circuits; Thermal factors; Boundary conditions; Electronic equipment; Electronics cooling; Heat transfer; Insulation; Isothermal processes; Mechanical engineering; Printed circuits; Temperature; Transformers;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1983.1136164
  • Filename
    1136164