DocumentCode
964535
Title
Thermally Optimum Arrays of Cards and Fins in Natural Convection
Author
Bar-Cohen, Avram ; Rohsenow, Warren M.
Author_Institution
Ben-Gurion University, Beer-Sheva, Israel
Volume
6
Issue
2
fYear
1983
fDate
6/1/1983 12:00:00 AM
Firstpage
154
Lastpage
158
Abstract
Recently derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces are applied to the thermal optimization of printed circuit cards and fin arrays. The procedure used and the governing relations, for both thermally symmetric and asymmetric card arrays, are presented. A similar development for arrays of natural convection fins, addressing the influence of fin thickness on the optimum fin spacing and maximum array heat dissipation, is also shown.
Keywords
Printed circuits; Thermal factors; Boundary conditions; Electronic equipment; Electronics cooling; Heat transfer; Insulation; Isothermal processes; Mechanical engineering; Printed circuits; Temperature; Transformers;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1983.1136164
Filename
1136164
Link To Document