Title :
An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates
Author :
Dougherty, William E. ; Greer, Stuart E.
Author_Institution :
IBM, Poughkeepsie, NY, USA
fDate :
6/1/1983 12:00:00 AM
Abstract :
In the IBM Corporation, packaging designs have evolved from single-sided circuitry on pinned ceramics to complex, multilayer structures with internally interconnected wiring produced with "punch and fill" via technology. The transverse via, a unique method of forming multilevel-multichip substrates without employing the via punching and filling process to form the interplane and input/output (I/O) communication paths, is described.
Keywords :
Ceramic materials/devices; Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; VLSI; Very large-scale integration (VLSI); Ceramics; Conductors; Fabrication; Integrated circuit interconnections; Metallization; Nonhomogeneous media; Packaging; Substrates; Very large scale integration; Wiring;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1983.1136169
