DocumentCode :
964658
Title :
Guest Editor´s Comments
Author :
Balde, J.
Author_Institution :
Interconnection Decision Consultings, NJ and Guest Editor, CHMT
Volume :
6
Issue :
3
fYear :
1983
fDate :
9/1/1983 12:00:00 AM
Firstpage :
226
Lastpage :
226
Keywords :
Connectors; Electronics packaging; Failure analysis; Heat transfer; Information analysis; Integrated circuit interconnections; Integrated circuit packaging; Shape; Societies; Thermal expansion;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1983.1136175
Filename :
1136175
Link To Document :
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