Title :
Guest Editor´s Comments
Author_Institution :
Interconnection Decision Consultings, NJ and Guest Editor, CHMT
fDate :
9/1/1983 12:00:00 AM
Keywords :
Connectors; Electronics packaging; Failure analysis; Heat transfer; Information analysis; Integrated circuit interconnections; Integrated circuit packaging; Shape; Societies; Thermal expansion;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1983.1136175
