Minimizing the hot spots [IC design]

Author

Volden, Tom ; Hootman, Joe

Author_Institution

Collins Avionics Div., Rockwell Int., USA

Volume

11

Issue

5

fYear

1995

fDate

9/1/1995 12:00:00 AM

Firstpage

23

Lastpage

26

Abstract

The MOVER software allows IC designers to create a quick and accurate thermal profile of the chips they design. This program is particularly useful when gallium arsenide is used for the fabrication of semiconductors, as its low thermal conductivity can lead to local hot spots on the circuit die. In addition to the thermal profile, the MOVER program also suggests changes to the circuit layout that can dramatically improve the thermal profile of a chip. The new software gives IC designers more flexibility in the use of an inexpensive design tool, and a better understanding of thermal reliability issues that arise in GaAs and dense Si chips

Keywords

circuit CAD; integrated circuit design; integrated circuit reliability; thermal conductivity; IC design; MOVER software; circuit layout; design tool; local hot spots; thermal conductivity; thermal profile; thermal reliability issues; Chip scale packaging; Electron mobility; Equations; FETs; Frequency; Gallium arsenide; Integrated circuit modeling; Silicon; Temperature; Thermal conductivity;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.465898

Filename

465898