Title :
Minimizing the hot spots [IC design]
Author :
Volden, Tom ; Hootman, Joe
Author_Institution :
Collins Avionics Div., Rockwell Int., USA
fDate :
9/1/1995 12:00:00 AM
Abstract :
The MOVER software allows IC designers to create a quick and accurate thermal profile of the chips they design. This program is particularly useful when gallium arsenide is used for the fabrication of semiconductors, as its low thermal conductivity can lead to local hot spots on the circuit die. In addition to the thermal profile, the MOVER program also suggests changes to the circuit layout that can dramatically improve the thermal profile of a chip. The new software gives IC designers more flexibility in the use of an inexpensive design tool, and a better understanding of thermal reliability issues that arise in GaAs and dense Si chips
Keywords :
circuit CAD; integrated circuit design; integrated circuit reliability; thermal conductivity; IC design; MOVER software; circuit layout; design tool; local hot spots; thermal conductivity; thermal profile; thermal reliability issues; Chip scale packaging; Electron mobility; Equations; FETs; Frequency; Gallium arsenide; Integrated circuit modeling; Silicon; Temperature; Thermal conductivity;
Journal_Title :
Circuits and Devices Magazine, IEEE
