DocumentCode
964775
Title
Electrical Design of a High Speed Computer Packaging System
Author
Davidson, Evan E.
Author_Institution
IBM Corp, Hopewell Junction, NY, USA
Volume
6
Issue
3
fYear
1983
fDate
9/1/1983 12:00:00 AM
Firstpage
272
Lastpage
282
Abstract
A methodology for optimizing the design of an electrical packaging system for a high speed computer is described The pertinent parameters are first defined and their sensitivities are derived so that the proper design trade-offs can ultimately be made. From this procedure, a set of rules is generated for driving a computer-aided design (CAD) system. Finally there is a discussion of design optimization and circuit and package effects on machine performance.
Keywords
Computer power supplies; Integrated circuit packaging; Large-scale integration; Design automation; Design optimization; Impedance; Integrated circuit interconnections; Integrated circuit packaging; Optimization methods; Packaging machines; Power distribution; Signal design; Voltage;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1983.1136188
Filename
1136188
Link To Document