Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices

The large difference in thermal expansion between silicon and the high conductivity metals is a major problem to be solved in the packaging of high power silicon devices. One solution is by the use of structured copper which is made of many separate copper wires and can he directly attached to silicon without introducing large stresses. Methods of preparing structured copper are presented along with some examples of its application.