Abstract :
Current high-speed PCB (printed circuit board) designs need extra care due to the frequency of operation and reduced rise time signals. We present the main issues and parameters that a PCB designer has to consider and analyze before a board layout is created. First order approximation equations for various parameters are presented, based on the geometry of the PCB traces. Some useful design practices are also mentioned. As the speed of operation increases, the variables that are neglected in the lower frequency/higher rise time situation become more significant. Such parameters increase the complexity of the design. Three-dimensional analysis becomes a must to calculate and model interconnects accurately. This is where field solvers and the role of the signal integrity engineer come into play.
Keywords :
approximation theory; interconnections; printed circuit design; printed circuit layout; board layout; design complexity; design practices; first order approximation equations; high speed PCB design; printed circuit board design; rise time signals; signal integrity engineer; three-dimensional analysis; Circuits; Dielectric materials; Frequency; Impedance; Microstrip; Power transmission lines; Propagation delay; Propagation losses; Routing; Signal design;
