DocumentCode
965196
Title
Solderless Press-Fit Interconnections: A Mechanical Study of Solid and Compliant Contacts
Author
Scaminaci, James, Jr.
Author_Institution
Elfab Corporation,Dallas,TX
Volume
6
Issue
2
fYear
1977
fDate
6/1/1977 12:00:00 AM
Firstpage
23
Lastpage
30
Abstract
The requirements for economical and reliable interconnections of multiple post terminations have advanced backpanel packaging technology to the use of printed circuit boards, precluding the use of solder and external wire connections. The characteristics of the interfaces between the printed circuit board and the post contact are discussed. The "interference" press-fit contact industry offers two concepts of contact to plated hole interface design. An analysis of these two designs is made with text guidelines underlining design, manufacture, and reliability.
Keywords
Component reliability; Contacts, mechanical factors; Manufacturing; Printed circuits; Connectors; Contacts; Costs; Integrated circuit interconnections; Manufacturing industries; Printed circuits; Soldering; Solids; Testing; Wire;
fLanguage
English
Journal_Title
Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0046-838X
Type
jour
DOI
10.1109/TMFT.1977.1136231
Filename
1136231
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