Title :
Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature
Author_Institution :
Cornell Aeronautical Lab., Inc.,
fDate :
9/1/1959 12:00:00 AM
Abstract :
Summary--Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies.
Keywords :
Assembly; Costs; Degradation; Electronic equipment; Electronics cooling; Heat transfer; Helium; Manufacturing; Temperature; Thermal resistance;
Journal_Title :
Production Techniques, IRE Transactions on
DOI :
10.1109/TPGPT.1959.1136241