Torsional stiffness and fatigue study of surface-mounted compliant leaded systems

Author

Engel, Peter A. ; Miller, Timothy M.

Author_Institution

Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA

Volume

16

Issue

6

fYear

1993

fDate

9/1/1993 12:00:00 AM

Firstpage

577

Lastpage

583

Abstract

Circuit cards with surface-soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The present work explores the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods and these were compared with finite-element results. The Engel-Ling coupled plate theory was found to correspond well to finite-element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law

Keywords

fatigue testing; soldering; surface mount technology; torsion; Coffin-Manson law; Engel-Ling coupled plate theory; J-leads; PCB cards; cyclic mechanical torque; fatigue study; gullwings; nonlinear load range; stiffness; structural analysis methods; structural integrity; surface-mounted compliant leaded systems; torque tests; torsional load tester; Capacitive sensors; Circuit testing; Fatigue; Finite element methods; Lead; Printed circuits; System testing; Test equipment; Torque; Vibrations;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.241782

Filename

241782