Title :
Torsional stiffness and fatigue study of surface-mounted compliant leaded systems
Author :
Engel, Peter A. ; Miller, Timothy M.
Author_Institution :
Dept. of Mech. & Ind. Eng., State Univ. of New York, Binghamton, NY, USA
fDate :
9/1/1993 12:00:00 AM
Abstract :
Circuit cards with surface-soldered compliant leaded modules are often subjected to torque tests to ensure their structural integrity. The present work explores the stiffness and fatigue behavior of such structures. A torsional load tester was devised, exerting cyclic mechanical torque at a desired fixed amplitude and frequency. Twisting loads up into the nonlinear load range were applied. Lead forces were computed by structural analysis methods and these were compared with finite-element results. The Engel-Ling coupled plate theory was found to correspond well to finite-element results. Fatigue failures occurred in the solder for J-leads and in the leads for gullwings. Fatigue curves resembled the Coffin-Manson law
Keywords :
fatigue testing; soldering; surface mount technology; torsion; Coffin-Manson law; Engel-Ling coupled plate theory; J-leads; PCB cards; cyclic mechanical torque; fatigue study; gullwings; nonlinear load range; stiffness; structural analysis methods; structural integrity; surface-mounted compliant leaded systems; torque tests; torsional load tester; Capacitive sensors; Circuit testing; Fatigue; Finite element methods; Lead; Printed circuits; System testing; Test equipment; Torque; Vibrations;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on