Title :
A method of adhesion strength test for thick film
Author :
Yata, Kunio ; Enokido, Yasushi ; Yamaguchi, Takashi
Author_Institution :
Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
fDate :
9/1/1993 12:00:00 AM
Abstract :
An adhesion strength test for thick films that requires no soldering was developed, and the adhesion strength of a silver-glass thick film on an alumina substrate was obtained. Three types of adhesion strengths were considered: prefracture adhesion strength, fracture process adhesion strength, and total adhesion strength, which is the sum of the other two adhesion strengths. The relation between these adhesion strengths and the microstructure is discussed. The strength of glass, the thickness of the glass layer, and densification of the silver powder are proposed as possible factors responsible for adhesion strength. A fracture mechanism for thick films, based on an analysis of the adhesion strength and observation of the microstructure, is proposed. Adhesion strength is evaluated using the Weibull distribution function
Keywords :
adhesion; borosilicate glasses; electrodes; fracture toughness testing; integrated circuit technology; silver; thick film devices; Ag-PbOB2O3-SiO2-Al2O3; Ag-PbOBSG-Al2O3; Al2O3; Weibull distribution function; adhesion strength test; densification; fracture process; glass; microstructure; prefracture; total adhesion strength; Adhesives; Glass; Microstructure; Powders; Silver; Soldering; Substrates; Testing; Thick films; Weibull distribution;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
