DocumentCode
965344
Title
Wafer-scale transducer arrays
Author
Chapman, Glenn H. ; Parameswaran, M. ; Syrzycki, Marek
Author_Institution
Simon Fraser Univ., Burnaby, BC, Canada
Volume
25
Issue
4
fYear
1992
fDate
4/1/1992 12:00:00 AM
Firstpage
50
Lastpage
56
Abstract
The production of wafer-scale transducer arrays using laser interconnection techniques and micromatching technology is discussed. The design of a wafer-scale thermal dynamic scene simulator that was implemented using the laser-linking redundancy technique is presented to illustrate typical design requirements. The simulator uses small arrays of thermal pixels and control circuitry in 3 mu m CMOS technology.<>
Keywords
CMOS integrated circuits; VLSI; image sensors; infrared detectors; micromechanical devices; transducers; 3 micron; CMOS technology; laser interconnection techniques; micromatching technology; redundancy technique; thermal dynamic scene simulator; thermal pixels; wafer-scale transducer arrays; Acoustic measurements; Fabrication; Gas detectors; Integrated circuit interconnections; Integrated circuit technology; Micromachining; Optical arrays; Sensor arrays; Sensor systems and applications; Transducers;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/2.129048
Filename
129048
Link To Document