Title :
A Novel Saw Device in CMOS: Design, Modeling, and Fabrication
Author :
Tigli, Onur ; Zaghloul, Mona E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Washington Univ., DC
Abstract :
The design, finite element modeling, fabrication, and characterization of a novel surface acoustic wave (SAW) delay line for bio/chemical and telecommunication applications in CMOS technology are introduced. A full modeling was carried out. The devices are designed in a standard semiconductor foundry 1.5-mum two-metal two-poly process. A unique maskless postprocessing sequence is designed and completed. The three postprocessing steps are fully compatible with any standard integrated circuit technology such as CMOS. This allows any signal control/processing circuitry to be easily integrated on the same chip. ZnO is used as the piezoelectric material for SAW generation. A thorough characterization and patterning optimization of the sputtered ZnO was carried out. The major novelties that are introduced in the SAW delay line features are the embedded heater elements for temperature control, compensation, and acoustic absorbers that are designed to eliminate edge reflections and minimize triple transit interference that is amplified by edge reflections. Both of these attributes are designed by using CMOS materials without disturbing SAW performance
Keywords :
CMOS integrated circuits; acoustic materials; compensation; finite element analysis; foundries; piezoelectric materials; surface acoustic wave delay lines; temperature control; zinc compounds; 1.5 micron; CMOS materials; CMOS technology; SAW delay line; SAW device; SAW generation; ZnO; acoustic absorbers; bio/chemical applications; embedded heater elements; finite element modeling; integrated circuit technology; maskless postprocessing sequence; piezoelectric material; semiconductor foundry; signal control/processing circuitry; sputtered ZnO; surface acoustic wave delay line; telecommunication applications; temperature compensation; temperature control; two-metal two-poly process; Acoustic reflection; CMOS technology; Chemical technology; Delay lines; Fabrication; Integrated circuit technology; Semiconductor device modeling; Surface acoustic wave devices; Surface acoustic waves; Zinc oxide; Absorber; CMOS; finite element modeling; heater; surface acoustic wave (SAW);
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2006.883771
