Title :
Thermal Considerations for Plastic Encapsulation or Coating in Electronic Product Design
Author :
Fairbanks, D.R. ; Mark, M.
Author_Institution :
Raytheon Company
fDate :
3/1/1962 12:00:00 AM
Keywords :
Coatings; Electronics packaging; Encapsulation; Heat sinks; Heat transfer; Plastics; Printed circuits; Product design; Space heating; Temperature;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136301
