DocumentCode :
965978
Title :
Technology of superconducting thin films on Si, SiO2, and Si3N4 for vacuum microelectronics
Author :
Aslam, Mohammad ; Soltis, Richard E. ; Logothetis, E.M. ; Chase, Richard E. ; Wenger, Lowell E. ; Chen, J.T.
Author_Institution :
Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
Volume :
36
Issue :
11
fYear :
1989
fDate :
11/1/1989 12:00:00 AM
Firstpage :
2693
Lastpage :
2696
Abstract :
A study of YBaCuO films on Si, SiO2, and Si3N4 substrates demonstrates that rapid thermal processing can suppress the film-substrate reaction during the postgrowth oxygen annealing. By increasing the copper content of YBaCuO films that are sputter-deposited on SiO2/Si to correspond to the 1:2:3 metal composition, the authors have achieved an onset of superconductivity above 95 K and a Tc(0) above 70 K through a rapid oxygen anneal for 6 s at 940 degrees C without a nitrogen preanneal. These results as well as results of others suggest that high Tc oxide superconductors could be used as electron sources or as cold emitters, gates, and collectors.
Keywords :
annealing; barium compounds; electron field emission; electron sources; high-temperature superconductors; sputtered coatings; superconducting thin films; vacuum tubes; yttrium compounds; 70 to 95 K; 940 degC; Si; Si3N4; SiO2; YBaCuO-Si; YBaCuO-Si3N4-Si; YBaCuO-SiO2-Si; cold emitters; collectors; electron sources; field emission; gates; high Tc oxide superconductors; high temperature superconductors; integrated vacuum tubes; postgrowth O2 annealing; rapid thermal processing; sputter-deposited; superconducting thin films; vacuum microelectronics; Buffer layers; Electron sources; High temperature superconductors; Microelectronics; Nitrogen; Rapid thermal annealing; Rapid thermal processing; Semiconductor films; Superconducting films; Superconducting materials; Superconducting thin films; Superconductivity; Vacuum technology; Yttrium barium copper oxide;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.43774
Filename :
43774
Link To Document :
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