Title :
Thermal Considerations for Plastic Encapsulation or Coating in Electronic Product Design
Author :
Fairbanks, D.R. ; Mark, M.
Author_Institution :
Raytheon Company, Mass
fDate :
7/1/1962 12:00:00 AM
Abstract :
The effects ofusing plastic compounds for encapsulation or coating of electronic circuitry are discussed with respect to cooling. The basic thermal mechanisms are presented. It is concluded that encapsulation or coating can significantly improve the cooling of small compact circuitry not employing direct metallic conduction paths or direct forced convection.
Keywords :
Circuits; Coatings; Electronics cooling; Encapsulation; Heat sinks; Heat transfer; Packaging; Plastics; Product design; Space heating;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136304
