Title :
Pros and Cons of 3-D Welded Cordwood Packaging
Author_Institution :
Electronics Laboratory, Kearfott Division, General Precision Aerospace
fDate :
12/1/1962 12:00:00 AM
Keywords :
Aerospace electronics; Electronics packaging; Glass; Laboratories; Nickel; Printed circuits; Resistors; Semiconductor diodes; Semiconductor films; Welding;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136319
