DocumentCode
966567
Title
A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation
Author
Otsuka, Kanji ; Shirai, Yuji ; Okutani, Ken
Author_Institution
Device Development Center of Hitachi Ltd., Japan
Volume
7
Issue
3
fYear
1984
fDate
9/1/1984 12:00:00 AM
Firstpage
249
Lastpage
256
Abstract
Plastic molded packages for large-scale integrated (LSI) devices are widely utilized for low-cost computer equipment. The environmental reliability of conventional plastic molded packages, however, is inferior to the reliability of hermetically sealed ceramic packages. A sealing mechanism for the chip, using a silicone jelly as an encapsulation, is discussed.
Keywords
Encapsulation; Integrated circuit packaging; Integrated circuit reliability; Corrosion; Encapsulation; Life estimation; Packaging machines; Petroleum; Plastic packaging; Protection; Rubber; Surface contamination; Testing;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1984.1136362
Filename
1136362
Link To Document