Title :
A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation
Author :
Otsuka, Kanji ; Shirai, Yuji ; Okutani, Ken
Author_Institution :
Device Development Center of Hitachi Ltd., Japan
fDate :
9/1/1984 12:00:00 AM
Abstract :
Plastic molded packages for large-scale integrated (LSI) devices are widely utilized for low-cost computer equipment. The environmental reliability of conventional plastic molded packages, however, is inferior to the reliability of hermetically sealed ceramic packages. A sealing mechanism for the chip, using a silicone jelly as an encapsulation, is discussed.
Keywords :
Encapsulation; Integrated circuit packaging; Integrated circuit reliability; Corrosion; Encapsulation; Life estimation; Packaging machines; Petroleum; Plastic packaging; Protection; Rubber; Surface contamination; Testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1984.1136362
