Dynamic Operational Stress Measurement of MEMS Using Time-Resolved Raman Spectroscopy

Author

Pomeroy, James W. ; Gkotsis, Petros ; Zhu, Meiling ; Leighton, G. ; Kirby, Paul ; Kuball, Martin

Author_Institution

Bristol Univ., Bristol

Volume

17

Issue

6

fYear

2008

Firstpage

1315

Lastpage

1321

Abstract

A dynamic-stress analysis method, based on time-resolved micro Raman spectroscopy, has been developed for reliability studies of microelectromechanical systems. This novel technique is illustrated by measuring temporally and spatially resolved stress maps of a piezoelectrically actuated silicon microcantilever when driven at its first- (6.094 kHz) and second-order (37.89 kHz) resonant frequencies. Stress amplitudes of up to 180 plusmn 10 MPa were measured at the maximum stress locations. The time-resolved Raman stress measurements are compared to the results of finite-element analysis and laser Doppler vibrometry.[2008-0003].

Keywords

Raman spectroscopy; cantilevers; finite element analysis; micromechanical devices; piezoelectric devices; stress analysis; Dynamic operational stress measurement; MEMS; dynamic-stress analysis method; finite-element analysis; frequency 37.89 kHz; frequency 6.094 kHz; laser Doppler vibrometry; microelectromechanical system; piezoelectrically actuated silicon microcantilever; resonant frequencies; time-resolved Raman spectroscopy; Microelectromechanical devices; reliability; simulation; spectroscopy; strain;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2008.2004849

Filename

4660281