DocumentCode
966713
Title
Laser Polysilicon Link Making
Author
Parker, Donald L. ; Lin, Fa-yong ; Zhang, Ding-Kanlg
Author_Institution
Texas A&M Univ., College Station, TX
Volume
7
Issue
4
fYear
1984
fDate
12/1/1984 12:00:00 AM
Firstpage
438
Lastpage
442
Abstract
Several laser polysilicon link-making structures have been fabricated and tested. Initial resistance of the laser targets were in the range 108
to 5 x 109
depending on the structure. The structures were serpentine raster scanned with Q-switched frequency doubled Nd:YAG (0.53µm) green laser radiation at various power levels. The size of the scan was 12.5 x 12.5 µm2. Link resistance after scanning at an appropriate power level was in the range 50
to 500
depending on link structure. All of the structures were tested for stability under subsequent high temperature thermal anneals. The results show that a) laser linkmaking targets can be compatible with conventional integrated circuit (IC) processing, b) that the link sizes can be scaled at least to 2 µm; and c) that the links can be closed with a single pulse of green laser radiation.
to 5 x 109
depending on the structure. The structures were serpentine raster scanned with Q-switched frequency doubled Nd:YAG (0.53µm) green laser radiation at various power levels. The size of the scan was 12.5 x 12.5 µm2. Link resistance after scanning at an appropriate power level was in the range 50
to 500
depending on link structure. All of the structures were tested for stability under subsequent high temperature thermal anneals. The results show that a) laser linkmaking targets can be compatible with conventional integrated circuit (IC) processing, b) that the link sizes can be scaled at least to 2 µm; and c) that the links can be closed with a single pulse of green laser radiation.Keywords
Laser applications, materials processing; Memory fault tolerance; Semiconductor memories; Annealing; Doping; Etching; Frequency; Implants; Optical pulses; Plasma applications; Pulse circuits; Pulsed laser deposition; Testing;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1984.1136374
Filename
1136374
Link To Document