Title :
A zero-Insertion-Force Hybrid Circuit Connector for Severe Environments
Author_Institution :
Microsystems Design, Clear Lake Shores, TX
fDate :
12/1/1984 12:00:00 AM
Abstract :
A new packaging technology has been developed for complex electronic circuits used in the high-temperature high-vibration environment of oil-well logging instrumentation. Specifically, the design and testing of a 72-pin connector that operates with large area ceramic substrates carrying leadless chip-carrier (LCC) devices and other thick film components is considered. The emphasis is on achieving high mechanical and electrical integrity during exposure to severe stress, while allowing easy field replacement of defective hybrid circuits without the need for any special tools to operate the release mechanism. A combination of mechanical shock (100 g levels) and vibration (10 g) with an extreme operating temperature range (- 55 to + 200°C) requires care in the choice of materials and the solution of some special design problems.
Keywords :
Connectors; Hybrid integrated circuit packaging; Hybrid integrated circuit thermal factors; Mechanical factors; Ceramics; Circuit testing; Connectors; Electric shock; Electronic circuits; Electronics packaging; Instruments; Stress; Substrates; Thick films;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1984.1136377