DocumentCode :
966742
Title :
A zero-Insertion-Force Hybrid Circuit Connector for Severe Environments
Author :
Sinclair, Paul
Author_Institution :
Microsystems Design, Clear Lake Shores, TX
Volume :
7
Issue :
4
fYear :
1984
fDate :
12/1/1984 12:00:00 AM
Firstpage :
378
Lastpage :
383
Abstract :
A new packaging technology has been developed for complex electronic circuits used in the high-temperature high-vibration environment of oil-well logging instrumentation. Specifically, the design and testing of a 72-pin connector that operates with large area ceramic substrates carrying leadless chip-carrier (LCC) devices and other thick film components is considered. The emphasis is on achieving high mechanical and electrical integrity during exposure to severe stress, while allowing easy field replacement of defective hybrid circuits without the need for any special tools to operate the release mechanism. A combination of mechanical shock (100 g levels) and vibration (10 g) with an extreme operating temperature range (- 55 to + 200°C) requires care in the choice of materials and the solution of some special design problems.
Keywords :
Connectors; Hybrid integrated circuit packaging; Hybrid integrated circuit thermal factors; Mechanical factors; Ceramics; Circuit testing; Connectors; Electric shock; Electronic circuits; Electronics packaging; Instruments; Stress; Substrates; Thick films;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1984.1136377
Filename :
1136377
Link To Document :
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