Title :
Packaging Design Considerations Using Conventional Components
Author :
Grassi, Donald A.
Author_Institution :
Raytheon Company
fDate :
1/1/1963 12:00:00 AM
Keywords :
Assembly; Costs; Electronics packaging; Integrated circuit interconnections; Joining processes; Lead; Manufacturing; Soldering; Space heating; Spot welding;
Journal_Title :
Product Engineering and Production, IEEE Transactions on
DOI :
10.1109/TPEP.1963.1136390