DocumentCode :
966897
Title :
Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model
Author :
Zhang, Mu-Shui ; Li, Yu-Shan ; Li, Li-Ping ; Jia, Chen
Author_Institution :
Xidian Univ., Xi´´an
Volume :
31
Issue :
1
fYear :
2008
Firstpage :
203
Lastpage :
210
Abstract :
In this paper, a new multisegment multiple transmission lines (MMTLs) SPICE model is developed to model and analyze high-speed and high-density connectors based on time domain reflectometry (TDR) measurements. It has advantages over the distributed inductance-capacitance (LC) model in aspects of stability and efficiency. The model is easy to understand and optimize. Its accuracy is easy to control. The precision function of the MMTL is extracted through simulations and measurements on which the modeling automation is based. Feedback theory is adopted to realize the automation process. Pro rata sampling method is introduced to reduce the variable space of the segments. Partial binary search method is applied to accelerate the search speed. With the novel modeling technique, a high accuracy model could be generated in a few minutes. The experimental results show that the proposed modeling method is of high accuracy and efficiency.
Keywords :
SPICE; electric connectors; integrated circuit interconnections; integrated circuit modelling; SPICE model; automation process; distributed inductance-capacitance model; feedback theory; high-density connectors; high-speed connectors; multisegment multiple transmission lines model; partial binary search method; pro rata sampling method; time domain reflectometry measurements; Connector; multisegment; partial binary search method; pro rata sampling method; time domain reflectometry (TDR);
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2007.908029
Filename :
4378290
Link To Document :
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