DocumentCode :
967054
Title :
Preparation of Actual-Size Printed Wiring Layouts
Author :
Guditz, Elis A.
Author_Institution :
M.I.T. Lincoln Laboratory
Volume :
7
Issue :
4
fYear :
1963
fDate :
9/1/1963 12:00:00 AM
Firstpage :
24
Lastpage :
28
Abstract :
Difficulties encountered in maintaining accurate registraion between layers of multilayer printed wiring cards has resulted in a method of preparing artwork actual size instead of by the usual enlarged artwork-photoreduction procedure. Fundamental to the approach is the fact that precise placement of lands, or pads, is more important than exact positioning of etched conductors: Accurate (±0.001 in) land location is assured by jig-boring land-size holes in sheet metal (Invar) and contact printing the hole pattern (lands) onto a glass photographic plate. Conductor paths are added using narrow (0.016 in min) black crepe printed-wiring layout tape. Presstype transfer letters and numbers are added as required for titles or identification. Final artwork is formed by proJection-printing the composite artwork onto another photographic plate using collimated light. Laboratory use of the technique has been successful in eliminating registration difficulties with 8 in x 15 in multilayer printed-wired cards.
Keywords :
Drilling; Etching; Glass; Humidity; Laboratories; Length measurement; Nonhomogeneous media; Particle measurements; Printing; Wiring;
fLanguage :
English
Journal_Title :
Product Engineering and Production, IEEE Transactions on
Publisher :
ieee
ISSN :
0097-4544
Type :
jour
DOI :
10.1109/TPEP.1963.1136407
Filename :
1136407
Link To Document :
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