DocumentCode
967087
Title
Thin Film Packaging and Interconnections: The Development of a Packaging Philosophy
Author
Martin, Howard B.
Author_Institution
U.S. Naval Air Development Center
Volume
7
Issue
4
fYear
1963
fDate
9/1/1963 12:00:00 AM
Firstpage
47
Lastpage
50
Keywords
Aircraft; Costs; Integrated circuit interconnections; Large-scale systems; Microelectronics; Packaging; Production systems; Reliability engineering; Thin film circuits; Transistors;
fLanguage
English
Journal_Title
Product Engineering and Production, IEEE Transactions on
Publisher
ieee
ISSN
0097-4544
Type
jour
DOI
10.1109/TPEP.1963.1136410
Filename
1136410
Link To Document