DocumentCode :
967087
Title :
Thin Film Packaging and Interconnections: The Development of a Packaging Philosophy
Author :
Martin, Howard B.
Author_Institution :
U.S. Naval Air Development Center
Volume :
7
Issue :
4
fYear :
1963
fDate :
9/1/1963 12:00:00 AM
Firstpage :
47
Lastpage :
50
Keywords :
Aircraft; Costs; Integrated circuit interconnections; Large-scale systems; Microelectronics; Packaging; Production systems; Reliability engineering; Thin film circuits; Transistors;
fLanguage :
English
Journal_Title :
Product Engineering and Production, IEEE Transactions on
Publisher :
ieee
ISSN :
0097-4544
Type :
jour
DOI :
10.1109/TPEP.1963.1136410
Filename :
1136410
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=967087
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