Title :
Temperature stable heat sink metallisation for improved bonding of c.w. stripe lasers
Author :
Lindstr¿¿m, C. ; Tihanyi, P.
Author_Institution :
Institute of Microwave Technology, Stockholm, Sweden
Abstract :
A heat sink metallisation system for use with indium soldering of semiconductor lasers is presented. The system, consisting of the metals InPtNiCu, is found to be temperature stable during a 1700 h storage test in 120°C. S.I.M.S. inspection detects no deterioration of the indium top layer. Ni is found to be an effective barrier for the Cu atoms in the heat sink and Pt provides good wetting of the indium solder, making the system suitable for large scale bonding procedures.
Keywords :
heat sinks; lead bonding; metallisation; semiconductor junction lasers; Cu; In soldering; InPtNiCu; Ni; Pt; heat sink metallisation; semiconductor lasers; wetting;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19800577
