DocumentCode :
967454
Title :
Thin-Film Circuit Techniques
Author :
Bohrer, John J.
Author_Institution :
International Resistance Co.
Volume :
7
Issue :
2
fYear :
1960
fDate :
6/1/1960 12:00:00 AM
Firstpage :
37
Lastpage :
44
Abstract :
The techniques used in producing thin-film circuits are discussed. Conductive, resistive and insulating films are evaporated separately onto glass substrates to form resistors, capacitors and interconnections. Active elements, transistors and diodes are mounted in holes drilled through the substrates. Studies aimed at developing thin-film active elements are discussed briefly. Several possible methods of interconnection are presented.
Keywords :
Capacitors; Conductive films; Diodes; Glass; Insulation; Integrated circuit interconnections; Resistors; Sputtering; Substrates; Thin film circuits;
fLanguage :
English
Journal_Title :
Component Parts, IRE Transactions on
Publisher :
ieee
ISSN :
0096-2422
Type :
jour
DOI :
10.1109/TCP.1960.1136448
Filename :
1136448
Link To Document :
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