Title :
Thin-Film Circuit Techniques
Author_Institution :
International Resistance Co.
fDate :
6/1/1960 12:00:00 AM
Abstract :
The techniques used in producing thin-film circuits are discussed. Conductive, resistive and insulating films are evaporated separately onto glass substrates to form resistors, capacitors and interconnections. Active elements, transistors and diodes are mounted in holes drilled through the substrates. Studies aimed at developing thin-film active elements are discussed briefly. Several possible methods of interconnection are presented.
Keywords :
Capacitors; Conductive films; Diodes; Glass; Insulation; Integrated circuit interconnections; Resistors; Sputtering; Substrates; Thin film circuits;
Journal_Title :
Component Parts, IRE Transactions on
DOI :
10.1109/TCP.1960.1136448