DocumentCode
967454
Title
Thin-Film Circuit Techniques
Author
Bohrer, John J.
Author_Institution
International Resistance Co.
Volume
7
Issue
2
fYear
1960
fDate
6/1/1960 12:00:00 AM
Firstpage
37
Lastpage
44
Abstract
The techniques used in producing thin-film circuits are discussed. Conductive, resistive and insulating films are evaporated separately onto glass substrates to form resistors, capacitors and interconnections. Active elements, transistors and diodes are mounted in holes drilled through the substrates. Studies aimed at developing thin-film active elements are discussed briefly. Several possible methods of interconnection are presented.
Keywords
Capacitors; Conductive films; Diodes; Glass; Insulation; Integrated circuit interconnections; Resistors; Sputtering; Substrates; Thin film circuits;
fLanguage
English
Journal_Title
Component Parts, IRE Transactions on
Publisher
ieee
ISSN
0096-2422
Type
jour
DOI
10.1109/TCP.1960.1136448
Filename
1136448
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