Title :
Noise in interconecction lines for submicrometer CMOS integrated circuits
Author :
Aranda, M.L. ; Vilela, V.C. ; Hernandez, F.M.
fDate :
7/1/2005 12:00:00 AM
Abstract :
The growing use of high performance portable systems is the main driving force for the significant advance in the technology of VLSI-CMOS integrated circuits. This advance has been carried out through scaling the transistor and interconnection sizes. However, as the transistor´s size and interconnections are getting smaller, the signal integrity is becoming a critical issue. Therefore it is required to develop noise tolerant design circuit techniques in order to enhance the noise tolerance. In addition, these techniques should have a minimum impact on the circuit performance. In this paper, the noise immunity of dynamic logical circuits as the technology scales down is analyzed by using a reliable scaling scenario, and a new noise tolerant design technique is proposed. Prototype circuits implementing the proposed technique have been designed and fabricated. A one-bit carry look-ahead adder was designed using 0.35 mm CMOS-AMS technology. The experimental results show that the design technique here presented, results in an improvement of the ANTE by a factor of 3.4X when compared with the conventional TSPC, and an improvement by a factor of 1.7X when compared with the best noise tolerant technique currently published.
Keywords :
VLSI technology; electrical noise; integrated circuits; Adders; CMOS integrated circuits; CMOS technology; Circuit noise; Circuit optimization; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit technology; Prototypes; Transistors; VLSI technology; electrical noise; integrated circuits;
Journal_Title :
Latin America Transactions, IEEE (Revista IEEE America Latina)
DOI :
10.1109/TLA.2005.1642413