Title :
Depth profiling of integrated circuits with thermal wave electron microscopy
Author_Institution :
University of California, Lawrence Livermore Laboratory, Livermore, USA
Abstract :
Nondestructive depth profiling of integrated circuits is performed with thermal wave electron microscopy at 640 kHz modulation frequency.
Keywords :
electron microscope applications; integrated circuit testing; nondestructive testing; integrated circuits; nondestructive depth profiling; thermal wave electron microscopy;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19800662
