Title :
Method of dissipating heat generated in high-voltage CMOS driver IC
Author :
Do, H.-L. ; Ok, C.-Y.
Author_Institution :
Digital PDP Div., LG Electron. Inc., Gongdan-Dong, South Korea
fDate :
6/8/2006 12:00:00 AM
Abstract :
A method of dissipating the heat generated in a high-voltage CMOS driver IC, which is designed for use with a flat panel display, is proposed. It utilises a charge pump circuit to reduce the voltage across the driver IC when its output stages change their status. It can reduce the power consumption and relieve the thermal problems of driver ICs.
Keywords :
CMOS integrated circuits; cooling; driver circuits; power integrated circuits; charge pump circuit; flat panel display; heat dissipation; high voltage CMOS driver IC; power consumption reduction;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20060754
