Title :
A New Scheme for Device Packaging
Author :
Auerbach, Abraham
Author_Institution :
Albany, NY
fDate :
9/1/1985 12:00:00 AM
Abstract :
A new method for forming low resistivity conductors in a doped polymer film has been used in a novel device packaging scheme. In a first application, the focused output of a laser is used to write silver connections between device bonding pads and package conductors to fabricate a working clock.
Keywords :
Integrated circuit interconnections; Interconnections, Integrated circuits; Laser applications, materials processing; Plastic materials/devices; Bonding; Clocks; Conductors; Consumer electronics; Costs; Electronics packaging; Packaging machines; Polymers; Silver; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1985.1136516
