DocumentCode
968165
Title
Foreword
Author
Gedney, R. ; Palkuti, L.
Author_Institution
CHMT Guest Editor
Volume
8
Issue
4
fYear
1985
fDate
12/1/1985 12:00:00 AM
Firstpage
409
Lastpage
409
Keywords
Bonding; Ceramics; Components, packaging, and manufacturing technology; Connectors; Corrosion; Materials reliability; Packaging; Paper technology; Plasma temperature; Wire;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1985.1136519
Filename
1136519
Link To Document