DocumentCode :
968165
Title :
Foreword
Author :
Gedney, R. ; Palkuti, L.
Author_Institution :
CHMT Guest Editor
Volume :
8
Issue :
4
fYear :
1985
fDate :
12/1/1985 12:00:00 AM
Firstpage :
409
Lastpage :
409
Keywords :
Bonding; Ceramics; Components, packaging, and manufacturing technology; Connectors; Corrosion; Materials reliability; Packaging; Paper technology; Plasma temperature; Wire;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1985.1136519
Filename :
1136519
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=968165
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