Title :
Thin Film Hybrid Integrated Circuits for Communication Systems
Author :
Orr, W.H. ; Robillard, T.R.
Author_Institution :
Bell Telephone Labs., Inc.
fDate :
6/1/1972 12:00:00 AM
Keywords :
Circuit testing; Hybrid integrated circuits; Integrated circuit interconnections; Logic circuits; Resistors; Semiconductor films; Semiconductor thin films; Silicon; Substrates; Thin film circuits;
Journal_Title :
Parts, Hybrids, and Packaging, IEEE Transactions on
DOI :
10.1109/TPHP.1972.1136560
