• DocumentCode
    968603
  • Title

    Embedded deterministic test

  • Author

    Rajski, Janusz ; Tyszer, Jerzy ; Kassab, Mark ; Mukherjee, Nilanjan

  • Author_Institution
    Mentor Graphics Corp., Wilsonville, OR, USA
  • Volume
    23
  • Issue
    5
  • fYear
    2004
  • fDate
    5/1/2004 12:00:00 AM
  • Firstpage
    776
  • Lastpage
    792
  • Abstract
    This paper presents a novel test-data volume-compression methodology called the embedded deterministic test (EDT), which reduces manufacturing test cost by providing one to two orders of magnitude reduction in scan test data volume and scan test time. The presented scheme is widely applicable and easy to deploy because it is based on the standard scan/ATPG methodology and adopts a very simple flow. It is nonintrusive as it does not require any modifications to the core logic such as the insertion of test points or logic bounding unknown states. The EDT scheme consists of logic embedded on a chip and a new deterministic test-pattern generation technique. The main contributions of the paper are test-stimuli compression schemes that allow us to deliver test data to the on-chip continuous-flow decompressor. In particular, it can be done by repeating certain patterns at the rates, which are adjusted to the requirements of the test cubes. Experimental results show that for industrial circuits with test cubes with very low fill rates, ranging from 3% to 0.2%, these schemes result in compression ratios of 30 to 500 times. A comprehensive analysis of the encoding efficiency of the proposed compression schemes is also provided.
  • Keywords
    automatic test pattern generation; boundary scan testing; data compression; design for testability; finite state machines; integrated circuit testing; ATPG; core logic; data volume compression; design for testability; embedded deterministic test; fill rates; linear finite state machines; logic binding; manufacturing test; on-chip decompressor; scan test time; test application time reduction; test cost reduction; test pattern generation; test points insertion; Associate members; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Costs; Encoding; Logic testing; Manufacturing industries; Pulp manufacturing;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2004.826558
  • Filename
    1291587