• DocumentCode
    968626
  • Title

    Development of Large Thick-Film Multilayer Assemblies

  • Author

    Issak, H. ; Kanz, J. ; Babiracki, E.G.

  • Author_Institution
    McDonnell Douglas Corp.
  • Volume
    8
  • Issue
    2
  • fYear
    1972
  • fDate
    6/1/1972 12:00:00 AM
  • Firstpage
    20
  • Lastpage
    29
  • Keywords
    Aerospace electronics; Assembly; Conducting materials; Dielectric materials; Dielectric substrates; Electronics packaging; Firing; Glass; Integrated circuit interconnections; Nonhomogeneous media;
  • fLanguage
    English
  • Journal_Title
    Parts, Hybrids, and Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0361-1000
  • Type

    jour

  • DOI
    10.1109/TPHP.1972.1136564
  • Filename
    1136564
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=968626